IDF Spring 2007 Content Index

Day Two

• Wolfdale versus Core 2 Duo
  Take a 45nm Penryn, chop it in two and throw half of it away and you have Wolfdale - the dual-core replacement for Core 2. We benchmark the new versus the old. Comments
  
  
• A round table discussion with Intel's Steve Smith
  bit-tech joins a European round table discussion with VP of Digital Enterprise Group Operations, Steve Smith, to discuss several hot topics. Comments
  
  
• Connectivity & the future of Mobile Computing
  Mobile Experts, Dadi Perlmutter and Anand Chandrasekher offer insights into the future of the UMPC and Intels vision of internet connectivity. Comments
  
  
• Benchmarking Penryn
  Intel showed off its 45nm successor to the Core Architecture, Penryn, in Beijing today. We have initial benchmark results -- click for details. Comments
  
  
• Corsair talks DDR3, EPP and Overclocking
  Continuing Richard's slight obsession with everything DDR3, bit-tech grabbed a word with Corsair Co-founder, John Beekley about his thoughts on the upcoming product. Comments
  
  
• Intel shows off Classmate PC at IDF
  The Intel Classmate PC offers an alternative to the $100 laptop and an education for developing countries, but competition is all good, right? Comments

Quad-core Penryn trounces QX6800 (left) Classmate PC demonstration (right)

Day One

• Phase Change Flash Memory is the Future
  Phase Change Flash Memory is tipped to replace the currently Solid State favourite (NAND) and be the future of storage. It might even replace DRAM. Comments
  
  
• UEFI will kill the BIOS... eventually
  Hate the fact new motherboards are great until you turn them on, only to find they have a really poor BIOS? So do we and UEFI is set to change exactly that. Comments
  
  
• More Details on Nehalem
  Dileep Bhandarker, Director of Advanced Architectures for Intel’s Digital Enterprise Group, spills the beans on Nehalem, the 45nm successor to the Core microarchitecture. Comments
  
  
• Gratuitous Naked Penryn Die Shots
  Ever wanted to see a Penryn die naked? At 45nm you sure can pack a lot of them on a 300mm wafer - pics inside.
  Comments
  
  
• Intel talks about Intel in China
  A summary of Day One keynotes by Justin Rattner, Director of Intel's Corporate Technology Group, and Pat Gelsinger, Senior Vice President and General Manager, Digital Enterprise Group. Comments
  
  
• Intel shares the details of Santa Rosa
  Intel’s Israeli mobile guru, Mooly Eden, details the next move in mobile processing: Santa Rosa, the next-generation of Centrino technology. Comments

Close-up of 45nm Penryn dies on a 300mm wafer (left) DDR3 memory module (right)

Preview Day

• More Adventures down DDR3 lane
  Hynix and Samsung show off DDR3 in Beijing. Comments
  
  
• Intel talks SATA and Flash
  Fresh details on SATA 3.0 and the future use of solid-state (NAND) memory in notebooks. Comments
  
  
• Intel Configures Antennas for a Multi-Radio Future
  By 2009 you could probably have something like six to ten radio devices inside your chosen mobile device. Richard Swinburne keeps count live from Beijing. Comments